Sensor
| Sensor | Sony IMX304 Gen2 |
|---|---|
| Mono/Color | Mono |
| Sensor type | 1.1″ CMOS |
| Shutter type | Global shutter |
| Resolution | 4096 × 3000 px |
| Pixel size | 3.45 × 3.45 µm |
| Exposure time | 0,001 … 60000 ms |
Image Formats & Frame Rate
| Image formats, interface frame rate max. | Full Frame, 4096 × 3000 px, max. 9 fps Binning 2×2, 2048 × 1500 px, max. 15 fps Binning 2×1, 2048 × 3000 px, max. 15 fps Binning 1×2, 4096 × 1500 px, max. 15 fps |
|---|---|
| Image formats, aquisition frame rate max. (Burst Mode) | Full Frame, 4096 × 3000 px, max. 15 fps |
| Pixel formats | Mono8 Mono10 |
Functions & Controls
| Analog controls | Gain (0 … 48 dB) Offset (0 … 255 LSB 12 Bit) |
|---|---|
| Color models | Mono |
| Basic Functions | Exposure Gain / Color Gain Trigger / Exposure Active (Flash) Binning 2x2 Partial Scan Offset Free Running Mode (Live Image) |
| Auto Functions | Exposure Auto Gain Auto |
| Image Pre-processing | Image Flipping (X/Y) |
| Acquisition / Interface | Burst Mode Adjustable Framerate Short Exposure Time Enable Device Link Throughput Limit Internal Image Buffer |
| Additional Functions | User Set Integrated temperature sensor Readable additional information (e.g. sensor information) Save Custom Data |
| Internal image buffer | 36 MB|1 image (Trigger Mode)|1 image (Free Running Mode) |
Synchronization & I/O
| Synchronization | free running trigger |
|---|---|
| Trigger sources | Hardware Software ActionCommand |
| Trigger delay | 0 … 2 sec, tracking and buffering of up to 256 trigger signals |
| Process Synchronization | Events Timer Trigger Delay Debouncer Counter Sequencer Trigger via Action CMD (GigE) Additional Output Modes (e.g. Trigger Ready) Chunk data inside transferred image Encoder support via Counter End trigger source |
| Lines | 1 input line 1 output line 2 general purpose lines |
Interface & Connectivity
| Data interface | Gigabit Ethernet, Transfer rate 1000 Mbits/sec, Fast Ethernet, Transfer Rate 100 Mbits/sec, Connector: 8P8C Modular Jack (RJ45), screwable type |
|---|---|
| Process interface | M8 / 8 pins (SACC-DSI-M8MS-8CON-M8-L180) |
| Power supply | via M8 / 8 pins or Power over Ethernet (PoE) |
Mechanical
| Lens mount | C-mount |
|---|---|
| Width | 29 mm |
| Height | 29 mm |
| Depth | 49 mm |
| Weight | ≤ 120 g |
| Material | zinc die casting, baked varnish (until 02-2020 nickel-chrome-plated), IP 40 |
| Protection class | IP 40 |
Electrical & Environment
| Power consumption | approx. 2,5 W 12 VDC and 9 fps approx. 3,0 W 48 VDC (PoE) and 9 fps |
|---|---|
| Flash memory size | 128 kB |
| Operating temperature | 0 … +65 ° T = measurement point |
| Humidity | 10 … 90 % (non-condensing) |
Compliance
| Conformity | CE RoHS KC (MISP-REI-BkR-VCXG-124M) EAC |
|---|
Other
| Voltage supply range +Vs | 12 … 24 V DC (external power supply)|36 … 57 V DC (Power over Ethernet) |
|---|
